CATHETER FLEXIBLE CIRCUITS
Enhancing catheter performance with flexible circuits
There is significant momentum and growing needs within medical field for catheter flexible circuits. Catheter related solutions provide minimally invasive procedures while addressing a broad range of applications. These applications include catheters for ablation, electrophysiology, mapping and diagnostic, angioplasty, stent deployment, and more.
FEATURES
Flexible circuits enhance catheter performance with improved movement control, durability, and dependable operation in medical procedures.Â
Ultra-thin, compact designs allow for greater flexibility ease of use, and enhanced functionality to minimally invasive applications.Â
Incorporate advanced sensors for real-time monitoring, diagnostics, and data collection to improve procedural accuracy and patient outcomes.
Built to withstand the rigors of catheter applications, offering flexibility, dynamic movement, and long-term reliability.Â
CATHETER SPECIFICATIONS
| ITEMS | MASS PRODUCTION |
|---|---|
| Layer | 1-6L |
| Thickness | Multi-layer board according to customer requirements |
| Single sided board: 0.065mm MIN | |
| Double-sided board: 0.125mm MIN | |
| Outline | Length: single/double/multi-layer: 1.45m MAX * |
| Width: single/double/multi-layer: 0.5mm - 0.8mm MIN * | |
| Multi-layer: 1.0mm MIN * | |
| *The data obtained from the average calculation according to the wiring of the product | |
| Options | Shield Film: (thickness: 16um, 20um) |
| FR4 (0.1-0.5mm) | |
| PI stiffener (0.075-0.225mm) | |
| Metallic stiffener (0.1-0.3mm) | |
| Min. Conductor Width & Spacing | Single and double sided circuit: 0.05mm |
| Multi-layered circuit: 0.075mm | |
| Alignment Tolerance Between Layers | 0.05mm |
| Conductor To Outline | Single and double sided circuit: >0.10mm |
| Multi-layer circuit: >0.15mm | |
| PAD To Outline | 0.2mm MIN |
| Min. Hole Size | Laser drill: Ø0.05mm |
| Mechanical drill PTH: Ø0.1mm | |
| Copper Plating Thickness | 10-15um (hole) |
| Min. Coverlay Openings | 0.50mm |
| Min. Coverlay Web | 0.30mm |
| Min. Solder Mask Opening | 0.20-0.30mm |
| Min. Solder Mask Web | 0.10mm |
| Max. Panel Size | ≤250*1500mm (single/double/multi-layer) |
| Final Finish | ENIG (NI:2-6um AU:0.05-0.09um) |
| Electroplated hard gold (NI:2-6um AU:0.1-1.0um) | |
| Electroplated soft gold (NI:2-6um AU:0.1-1.0um) | |
| Trim Method | Laser (outline<1mm) |
| Tooling (Outline>1mm)-- tooling costs ≥ $4k | |
| Impedence Requirement | Differential impedance: 100ohms+/-10% |
RESOURCES
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